Photonics in Telecom / Datacom

Photonics in telecom and datacom is a key enabler of global digitalization, providing the backbone for high-capacity, low-latency and energy-efficient data transmission. The exponential growth of cloud services, AI workloads, 5G/6G networks and data centers is continuously driving the demand for higher bandwidth, shorter reach and increased integration density. This development accelerates the transition from electrical to optical interconnects across all network levels – from long-haul and metro networks to data center interconnects and on-board optical links.

Modern telecom and datacom systems rely on highly integrated optical components such as transceivers, photonic integrated circuits (PICs), lasers, modulators and fiber-optic interfaces. Achieving reliable high-speed transmission requires sub-micron alignment accuracy, stable optical coupling and reproducible assembly processes at scale. In particular, the integration of fibers or fiber arrays to PICs, as well as the hybrid integration of lasers and detectors, places stringent demands on active alignment, bonding and testing.

We provide solutions for the automated assembly and testing of telecom and datacom photonic modules, covering laser-to-PIC integration, fiber and FAU attachment, and high-precision alignment of optical sub-components. Our platforms support active alignment under optical and electrical operation, enabling maximum coupling efficiency and long-term stability. In addition, we offer integrated test concepts for optical performance, allowing verification of complete modules under realistic operating conditions and ensuring the scalability required for volume production.